Semiconductor Advanced Packaging Market Size to grow by USD 22.79 billion between 2024-2028
According to a research report “ Semiconductor Advanced Packaging Market” by Device (Analog and mixed ICs, MEMS and sensors, Logic and memory devices, Wireless connectivity devices, CMOS image sensors) Technology (Flip chip, FI WLP, 2.5D/3D, FO WLP) Geography (APAC, North America, Europe, South America, Middle East and Africa)- Global Forecast to 2028 published by Technavio, the market size is estimated to grow by USD 22.79 billion, at a CAGR of 8.72% during the forecast period. In the dynamic consumer electronics market, manufacturers continually strive to differentiate their products through increased functionality and features. This trend has led to a heightened demand for multifunctional Integrated Circuits (ICs). In response, semiconductor companies have innovated by creating intricate architectures and designs for ICs, such as 3D ICs. These advanced ICs offer benefits like compactness, power efficiency, and high functionality, but they also come with complex designs and intricate manufacturing processes. To meet the evolving demands of IC design and production, semiconductor foundries must invest in state-of-the-art equipment and advanced production systems, ensuring they remain at the forefront of semiconductor packaging technology..
Browse market data tables, figures, and in-depth TOC on “Semiconductor Advanced Packaging Market” by Device (Analog and mixed ICs, MEMS and sensors, Logic and memory devices, Wireless connectivity devices, CMOS image sensors) Technology (Flip chip, FI WLP, 2.5D/3D, FO WLP) Geography (APAC, North America, Europe, South America, Middle East and Africa) Global Forecast to 2028. Download Free Sample
By Device, the Analog and mixed ICs segment is projected to dominate the market size in 2024
The semiconductor advanced packaging market has experienced steady growth, driven by the increasing demand for analog Integrated Circuits (ICs) across various industries, including communication, consumer electronics, and automotive. New product development and the decreasing cost per function of ICs have fueled this demand. Technological advancements in the semiconductor sector have led to the creation of efficient analog ICs, delivering enhanced performance. Consequently, the market for 3D ICs, Fan-Out Wafer Level Packaging (FO WLPs), and Flip-In Wafer Level Packaging (FI WLPs) in the analog and mixed IC segment is expected to expand significantly during the forecast period. Advanced packaging solutions are essential to ensure the robust performance of these complex ICs.
By Technology, Flip chip segment is expected to hold the largest market size for the year 2024
In the semiconductor industry, flip-chip packaging has emerged as a leading advanced packaging technology. This technique involves flipping the chip, exposing the active side downwards, and bonding it with package leads using external wire interconnections. The metal bumps, underfilled with epoxy, facilitate numerous interconnects with shorter distances, thereby reducing inductance. The market growth is driven by the burgeoning demand for mobile and consumer electronic devices. Key factors fueling this trend include the increasing shipment of mobile devices and the anticipated high adoption of 2.5D and 3D packaging technologies.
APAC is forecasted to hold the largest market size by region in 2024
The semiconductor advanced packaging market in APAC is experiencing significant growth, driven by the presence of leading semiconductor foundries, including TSMC, United Microelectronics, Samsung Semiconductor, and Semiconductor Manufacturing International (SMIC), and a multitude of outsourced semiconductor assembly and test (OSAT) vendors. These manufacturers are making substantial investments in constructing new facilities in the region, with China anticipated to house two or three 450-mm fabs by 2022. Taiwan, with its robust consumer electronics market, is another crucial market for advanced packaging solutions, further fueling market expansion in APAC.
The Semiconductor Advanced Packaging Market growth and forecasting report also includes detailed analyses of the competitive landscape of the market growth and forecasting and information about 20 market companies, including:
.
For insights on company offerings- Request a sample report!
Research Analysis Overview
The advanced packaging market is experiencing significant growth due to the increasing demand for compact, high-performance, and energy-efficient electronic devices. Programmable logic controllers (PLCs) in various industries are adopting advanced packaging technologies such as Fan-Out Wafer-Level Packaging (Fan-Out WLP) and Wafer-Level Chip Scale Packaging (WLCSP) for miniaturization and enhanced reliability. In the semiconductor industry, power devices for mobiles and data centers are being packaged using Flip-chip Chip Scale Packaging (FC-CSP) for high-speed and high-density applications. Advanced packaging technologies are also being integrated with AI, machine learning, and deep learning technologies for power management, thermal management, and signal integrity. The integration of AI technologies in the advanced packaging industry is expected to revolutionize the IoT sector by enabling high computing power and energy efficiency. Process nodes are continuously shrinking, and advanced packaging solutions are essential to manage the increasing complexity of wires, bridges, and chips. The market for advanced packaging is expected to grow significantly in the coming years, driven by the demand for compact, high-performance, and energy-efficient devices.
Market Research Overview
The Semiconductor Advanced Packaging Market is experiencing significant growth due to the increasing demand for miniaturized, high-performance, and energy-efficient electronic components. Embedded processors and programmable logic controllers are key applications driving this market. Advanced packaging technologies such as Fan-Out Wafer-Level Packaging (WLP), Wafer-Level CSP, and Flip-Chip CSP are gaining popularity for their ability to enhance functionality and performance. Deep learning, machine learning, and AI technologies are also fueling the market's growth, with power devices, MEMS, RFID, and other modern electronic components requiring advanced packaging solutions. Thin wafers and semiconductor IC manufacturing are also driving the need for innovative techniques like 3D integration and System-inPackage (SiP) for improved thermal management and space optimization. Power dissipation and thermal management challenges are critical issues in advanced packaging, with solutions including improved thermal management, cooling, and heat dissipation. Heterogeneous integration of diverse materials is also a key trend, enabling enhanced functionality and denser electronic devices. The advanced packaging industry is also impacted by the growth of 5G technology, which requires high-speed and high-frequency applications with minimal signal delays and interconnection lengths. Semiconductor sales are expected to grow, with the Semiconductor Industry Association reporting continued growth in the industry. Advanced packaging is used in various applications, including wearables, mobiles, automotive, aerospace and defense, healthcare, IT & telecommunication, and consumer electronics. The market is expected to continue growing due to the increasing demand for cost-effective, high-performance, and miniaturized packaging solutions.
Contacts
Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/
