Authored By: Sarah
27 Jun 2024

 CMP Equipment Market Size to grow by USD 702.42 million between 2024-2028

According to a research report “ CMP Equipment Market” by Application (Foundries, IDMs) Type (300mm, 200mm, 150mm) Geography (APAC, North America, Europe, South America, Middle East and Africa)- Global Forecast to 2028 published by Technavio, the market size is estimated to grow by USD 702.42 million, at a CAGR of  5.25% during the forecast period. In the semiconductor industry, the increasing adoption of Chemical Mechanical Planarization (CMP) equipment is primarily driven by technological advancements, escalating demand for sophisticated semiconductor devices, and substantial investments in research and development. Key factors fueling this trend include the growing requirement for precise planarization as semiconductor devices evolve with smaller feature sizes and intricate three-dimensional structures. Moreover, CMP plays a pivotal role in enhancing manufacturing yields by ensuring uniformity across semiconductor wafers, thereby reducing wastage and increasing overall efficiency.

Browse market data tables, figures, and in-depth TOC on “CMP Equipment Market” by Application (Foundries, IDMs) Type (300mm, 200mm, 150mm) Geography (APAC, North America, Europe, South America, Middle East and Africa) Global Forecast to 2028. Download Free Sample


By Application, the Foundries segment is projected to dominate the market size in 2024

In the realm of semiconductor manufacturing, the shift towards 300 mm CMP equipment signifies a significant advancement in wafer size from the previous standard of 200 mm. With a diameter of approximately 12 inches, a 300 mm wafer yields increased manufacturing efficiency and higher chip yield per unit. This transition has been a prominent trend in the semiconductor industry, enabling the production of more chips per wafer and consequently reducing overall costs. The implementation of larger wafers contributes to both cost-effectiveness and technological progression within the sector.

By Type, 300mm  segment is expected to hold the largest market size for the year 2024

In the semiconductor industry, CMP (Chemical Mechanical Planarization) equipment is an indispensable asset in foundries, facilitating the production of integrated circuits (ICs). This technology plays a pivotal role in planarizing semiconductor wafers, ensuring flat and smooth surfaces for subsequent processing steps. During the IC manufacturing process, multiple layers of materials, including silicon dioxide, metals, and other films, are deposited on the wafer. CMP equipment is essential for removing excess material and achieving uniformity between these layers, specifically during interlayer dielectric (ILD) planarization. By providing a leveled surface, CMP equipment enhances the overall efficiency and productivity of semiconductor fabrication.

APAC is forecasted to hold the largest market size by region in 2024

The Asia Pacific (APAC) region is the leading contributor to the global CMP equipment market in 2023, accounting for the largest revenue share. This dominance is primarily due to the high concentration of key players, including foundries, semiconductor wafer manufacturers, semiconductor manufacturers, original equipment manufacturers (OEMs), and original design manufacturers (ODMs), in the region. Notable countries driving market growth include China, Taiwan, South Korea, and Japan. The presence of prominent semiconductor foundries, such as Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics, significantly fuels the demand for CMP equipment in APAC. Moreover, APAC is the largest consumer of semiconductor devices, with major players in the consumer electronics and mobile devices industries, like Samsung, Sony, LG, Toshiba, and Panasonic, contributing significantly to the total revenue of the semiconductor industry.

The CMP Equipment Market growth and forecasting report also includes detailed analyses of the competitive landscape of the market growth and forecasting and information about 20 market companies, including:

  • Alpsitec
  • Amtech Systems Inc.
  • Applied Materials Inc.
  • Axus Technology
  • DuPont de Nemours Inc.
  • Ebara Corp.
  • Entegris Inc.
  • FLP Microfinishing GmbH
  • Hitachi Ltd.
  • Kakou USA LLC.
  • Kemet International Ltd.
  • Logitech International SA
  • Okamoto Machine Tool Works Ltd.
  • Stahli USA
  • Tokyo Seimitsu Co. Ltd.
  • Lapmaster Wolters
  • Samsung Electronics Co. Ltd.
  • Fraunhofer Gesellschaft
  • Revasum Inc.

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Research Analysis Overview

The CMP (Chemical-Mechanical Polishing) equipment market plays a crucial role in the semiconductor industry by ensuring the uniform surface finish of various components, including semiconductor wafers, memory disks, and printed circuit boards. Slurry testing equipment is essential in this process, as it helps assess the quality of the CMP slurries used for multi-selective removal of chips and other fabrication materials. CMP is vital for achieving planarity levels required in integrated circuit fabrication, including memory disks, integrated circuits, MEMS, molded interconnect devices, and interconnects. These components are used in various applications, such as electric vehicles, consumer electronics, and transistors. Planarization techniques like wafer thinning and chemical-mechanical polishing are used to ensure the uniformity and smoothness of the wafer surface. These techniques involve mechanical movements and the use of chemical elements to remove material from the wafer surface. The CMP equipment market caters to the needs of various industries, including the semiconductor industry, which relies heavily on CMP for producing high-quality electronic devices. The market is expected to grow due to the increasing demand for advanced electronic devices and the continuous miniaturization of semiconductor devices.

Market Research Overview

The CMP (Chemical Mechanical Polishing) equipment market encompasses a wide range of substrates and consumables used in the polishing process for various electronic devices. CMP is a critical process in IC manufacturing, including PCB production, infotainment devices, telematics, videogame consoles, TVs, computers, smartphones, LEDs, 3D devices, mobile devices, PCs, Microelectromechanical Systems (MEMS), and Molded Interconnect Devices (MID). CMP involves the use of pads and slurries to achieve planarity levels on wafer surfaces, removing material through both chemical and mechanical forces. CMP models employ various material removal mechanisms, such as oxide dielectric and multi-selective removal, to ensure a uniform surface for chips and semiconductor wafers. Slurry testing equipment is essential for evaluating the quality of CMP slurries, which are liquid dispersions of abrasive particles. The CMP market caters to various industries, including automobiles, consumer electronics, and semiconductor industry. Wafer manufacturers require CMP equipment and consumables for processing nodes, with Moore's technologies driving the need for smaller processing nodes and wafer sizes. CMP manufacturers and consumable suppliers provide equipment and materials for MEMS, NEMS, and compound semiconductors. Environmental impact is a growing concern in the CMP industry, with the use of plasma polishing, dry etching, and metal polishing raising concerns. The market also serves the fabrication of integrated circuits, interconnects, transistors, and planarization techniques, such as wafer thinning and fabrication materials. CMP equipment and consumables are integral to the production of electronic devices, including 5G technology, Internet of Things, and integrated circuit fabrication. The market is continuously evolving to meet the demands of emerging technologies, such as 3D IC, plasma polishing, and liquid dispersions. CMP pads and slurries are essential components in the production of various consumer electronic products, from chip design to final assembly.


Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200

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