Research Expert: Sarah Overall
  • Published: Mar 2025
  • Pages: 150
  • SKU: IRTNTR72979

  • SRAM And ROM Design IP Market Growth Trends and Forecast (2024-2028)

    The SRAM And ROM Design IP market is projected to grow by USD 31.2 million at a CAGR of 1.8% between 2023 and 2028. The increasing demand for power-efficient memory solutions across various industries is driving market expansion. Factors such as data center growth, proliferation of 5G networks, connected devices, edge computing, and autonomous vehicles are significantly influencing demand. Additionally, non-volatile memory technologies such as MRAM and ReRAM are gaining traction due to their superior performance over traditional volatile memory solutions.

    Global SRAM And ROM Design IP Market 2024-2028

    For more details about the industry, get the PDF sample report for free

    Market Segmentation

    By Type:

    • SRAM
    • ROM

    By Geography:

    • APAC
      • China
      • India
      • Japan
      • South Korea
    • North America
      • Canada
      • US
    • Europe
      • Germany
      • France
      • Italy
      • Spain
    • South America
    • Middle East and Africa

    Market Insights by Type

    SRAM Segment

    The SRAM segment is expected to witness substantial growth, particularly in applications requiring low power consumption and high-speed processing. Industries such as data centers, enterprise storage, cloud computing, and automotive rely on SRAM for its fast access times and ability to handle increasing workloads efficiently.

    • In data centers, 5G and edge computing are key drivers of low-power, high-density memory adoption.
    • Connected devices and autonomous vehicles require non-volatile memory to maintain data integrity even during power loss.
    • The hyper-converged infrastructure (HCI) sector is integrating SRAM and ROM Design IP for efficient storage and data processing solutions.

    In 2018, the SRAM market was valued at USD 257 million. With the increasing demand for optimized power consumption and enhanced data processing, organizations are integrating SRAM and ROM Design IP into their products to maintain high performance while minimizing energy consumption.

    Market Dynamics

    Drivers

    1. Rising Demand for Faster Processing Speeds

    SRAM’s ability to access data within 10 nanoseconds, compared to DRAM’s 60 nanoseconds, makes it an ideal choice for fast-processing applications. This capability is crucial in:

    • Microcontrollers and programmable devices used in consumer electronics and embedded systems.
    • Artificial Intelligence (AI) and machine learning applications, where rapid data access is essential for model training and inference.
    • Low-power computing in on-device machine learning, system-on-module (SoM), and low-power computer vision applications.

    2. Increasing Deployment in Data Centers and Enterprise Storage

    Data centers require high-performance, low-power memory solutions to manage increasing workloads. SRAM and ROM IPs are crucial in:

    • Hyper-converged infrastructure (HCI), where efficient data storage and retrieval reduce power consumption.
    • Cloud computing and enterprise storage, which demand scalable and energy-efficient memory solutions.
    • 5G network expansion and edge computing, both of which require low-latency memory architectures.

    3. Growing Use of Non-Volatile Memory Technologies

    The increasing adoption of MRAM (Magneto Resistive Random-Access Memory) and ReRAM (Resistive Random-Access Memory) is reshaping the market. These memory solutions offer:

    • Higher density compared to traditional volatile memory.
    • Lower power consumption for embedded and enterprise applications.
    • Faster read/write cycles, making them suitable for cache memory in enterprise storage.

    Trends

    1. Increasing Demand for Enterprise Storage Solutions

    The rise of IoT, AI, and big data analytics has led to increased storage requirements. MRAM adoption is rising, as it provides:

    • Low-latency access for critical data caching in enterprise storage.
    • Higher endurance than DRAM, ensuring long-term reliability.
    • Better power efficiency, reducing operational costs in data centers.

    2. Advancements in Semiconductor Manufacturing

    Leading semiconductor firms are focusing on scaling up memory production to enhance:

    • Memory density while reducing power consumption.
    • Manufacturing processes for SRAM and ROM IP, ensuring compact and high-performance storage solutions.

    3. Expansion of Wireless Networks and Online Content Consumption

    The global rise in wireless networks, cloud-based services, and media streaming is fueling the need for efficient, high-capacity memory architectures, including SRAM and ROM IPs.

    Challenges

    1. Scaling Issues in SRAM Technology

    Despite its advantages, SRAM faces challenges in terms of:

    • Cell stability at smaller process nodes.
    • Physical area constraints, impacting memory density.
    • Voltage mismatch issues, affecting reliability in advanced applications.

    2. High Manufacturing Costs

    The development of advanced SRAM and ROM IP requires significant investments in semiconductor fabrication, impacting overall production costs.

    Market Research Overview

    The growing demand for SRAM Design IP and ROM Design IP is driven by the increasing adoption of semiconductor memory IP in memory-intensive applications such as AI, IoT, and 5G networks. As industries continue to prioritize low-power SRAM design, manufacturers are developing embedded memory solutions that offer high-performance memory IP with enhanced efficiency. The integration of static random access memory and read-only memory in data center memory IP and 5G network memory design is critical for managing high-speed data processing and storage requirements. Moreover, advancements in cache memory design IP are addressing the need for optimized data retrieval and storage in next-generation computing systems

    Get more details by ordering the complete report

    Leading Companies in the SRAM and ROM Design IP Market:

    • Advanced Micro Devices Inc.
    • AnySilicon
    • Arm Ltd.
    • Avalanche Technology Inc.
    • Cadence Design Systems Inc.
    • CEVA Inc.
    • Dolphin Technology Inc.
    • eMemory Technology Inc.
    • Everspin Technologies Inc.
    • Infineon Technologies AG
    • Integrated Silicon Solution Inc.
    • Microchip Technology Inc.
    • Renesas Electronics Corp.
    • STMicroelectronics International NV
    • Surecore Ltd
    • Synopsys Inc.
    • Toshiba Corp

    Research Analysis Overview

    Technological advancements in non-volatile memory IP are reshaping the semiconductor industry by enabling efficient firmware storage solutions and memory IP for IoT devices. The increasing demand for AI memory solutions has led to the development of advanced node semiconductor IP, catering to high-speed processing applications. Additionally, the adoption of compact memory modules in mobile and edge computing devices is fueling the growth of energy-efficient memory IP solutions. As the market continues to evolve, key players are focusing on innovations in SRAM and ROM market trends to enhance scalability and reliability in next-generation computing and communication systems.

     

     

     

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