Latest News- Surface Mount Technology (Smt) Placement Equipment Market: Consumer electronics is expected to lead the End-user segment during 2024-2028

The Surface Mount Technology (Smt) Placement Equipment Market is being driven by Surge in demand for PCBs

The Surface Mount Technology (Smt) Placement Equipment Market is expected to grow at a CAGR of 6.78% during 2023 and 2028. During this period, the market is also expected to show a growth of USD 896.5 million. Advanced Surface Mount Technology (SMT) placement equipment is a crucial investment for businesses seeking to enhance their production capabilities. These systems offer increased throughput and seamless integration with other SMT equipment. Vendors prioritize the implementation of flexible and modular gantry systems and advanced feeder systems. Linear motors are utilized on the X and Y axes to boost accuracy, speed, and servo-loop stiffness. High servo-loop gain is emphasized, as it results in increased axis acceleration and deceleration, reducing induction motor heating, and prolonging equipment operational time. Furthermore, high-resolution verification cameras and fine adjustment systems are integrated into SMT placement equipment to ensure precise and efficient placement of electronic components onto PCBs prior to soldering. 

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Which Factors Are Causing a Surge in Market Growth?

The market is segmented based on

• End-user
  • Consumer electronics
  • Automotive
  • Telecom
  • Others
• Type
  • High-speed
  • Medium-speed
• Geography
  • APAC
    • China
    • Japan
  • Europe
    • Germany
    • UK
  • North America
    • US
  • Middle East and Africa
  • South America

According to Technavio, There are several factors that are causing the market to flourish during the forecast period, which are as follows: 

• Surge in demand for PCBs
• Shift toward flexible and responsive manufacturing methods
• Miniaturization of components

However, the market also witnesses some limitations, which are as follows:

• High cost of deployment
• Lack of skilled workers
• Preference for leasing SMT placement equipment among end-users

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Market Scope in Surface Mount Technology (Smt) Placement Equipment Market Research Report

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Research Analysis Overview

Surface Mount Technology (SMT) placement equipment market is witnessing significant growth due to the increasing demand for compact, high-performance electronic devices in consumer electronics. SMT allows for the placement of active and passive components directly onto the surface of circuit boards, reducing the need for traditional through-holes technology and minimizing the carbon footprint. The market for SMT placement equipment is driven by the production of consumer electronics, including smart televisions, fingerprint sensors, HDMI connectors, USB ports, and surface mount connectors. These devices require the precise placement of electronic components such as inductance interconnects, capacitors, resistors, and diodes. Advanced SMT placement equipment utilizes AI-driven quality control, robotic placement, and reflow soldering processes to ensure high-quality production. The challenges of SMT, such as cross-talk noise and thermal management, are being addressed through innovative solutions. High-frequency applications, such as 5G technology and wireless charging, are also driving demand for SMT placement equipment that can handle smaller components and higher precision. The SMT placement equipment market is expected to continue growing as the demand for smaller, more efficient electronic devices increases. The use of solder paste and the reflow soldering process remains a critical component of the SMT manufacturing process. Overall, the SMT placement equipment market is poised for continued growth as it enables the production of advanced electronic devices in various industries.

Market Research Overview

The Surface Mount Technology (SMT) placement equipment market is a significant segment of the larger global semiconductor materials and equipment industry. This market encompasses manufacturers engaged in the production of equipment used for the assembly and packaging of semiconductor devices. According to Technavio's market analysis, the global semiconductor materials and equipment market size is determined by the revenues generated from the sales of various components, including wafer processing, mask/reticle manufacturing, wafer manufacturing, fab facilities equipment, assembly and packaging, and test equipment. The expansion of this market can be attributed to the surge in investments for the establishment of new semiconductor fabrication plants worldwide, fueled by the escalating demand for integrated circuits (ICs) across industries.. Industries are leveraging the products belonging to the market for customer engagement, transactional notifications, and promotional offers.

Technavio Research
Jesse Maida
Media & Marketing Executive
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