Latest News- Semiconductor Packaging Materials Market: Organic substrates is expected to lead the Material segment during 2025-2029

The Semiconductor Packaging Materials Market is being driven by Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT

The Semiconductor Packaging Materials Market is expected to grow at a CAGR of 5.6% during 2024 and 2029. During this period, the market is also expected to show a growth of USD 10197.6 million. In response to international regulations such as the RoHS directive adopted by the European Union, which restricts the use of hazardous substances in electronic device packaging, lead-free alternatives are becoming increasingly preferred. Lead frames, for instance, now utilize matte tin for the post plate and nickel-palladium-silver alloys for the pre-plate, replacing lead. Additionally, System-in-Package (SiP) solutions are experiencing significant growth due to their advantages, including cost savings, system integration, and complete configuration. These trends are expected to shape the semiconductor packaging materials market during the forecast period. 

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Which Factors Are Causing a Surge in Market Growth?

The market is segmented based on

• Material
  • Organic substrates
  • Lead frames
  • Bonding wires
  • Ceramic packages
  • Others
• End-user
  • Consumer electronics
  • Automotive
  • Medical devices
  • Communication and telecom
  • Others
• Technology
  • Grid array
  • System-in-package (SIP)
  • Others
• Geography
  • APAC
    • China
    • India
    • Japan
    • South Korea
  • North America
    • Canada
    • US
  • Europe
    • Germany
    • UK
  • South America
    • Brazil
  • Middle East and Africa

According to Technavio, There are several factors that are causing the market to flourish during the forecast period, which are as follows: 

• Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT
• Advanced semiconductor material packaging technologies
• Surge in global demand for consumer electronics and smart electronic devices

However, the market also witnesses some limitations, which are as follows:

• Capital-intensive market
• Technical problems with tape-based substrates and consumption concentrated in a specified region
• Regulations associated with semiconductor packaging materials

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Market Scope in Semiconductor Packaging Materials Market Research Report

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Research Analysis Overview

The Semiconductor Packaging Materials Market encompasses various components including Packaging Technologies, Encapsulation Resins, Bonding Wires, Die Attach Materials, Underfill Materials, Tape Substrates, Liquid Encapsulation, Photopolymer Films, Wafer Bonding, Dielectric Materials, Electroless Plating, Packaging Assembly, IC Substrates, Bonding wire, Lead frames, Ceramic packages, and Encapsulation resins. These materials are essential for IC manufacturing, enabling advanced packaging solutions in consumer electronics, IoT devices, high-performance computing, and smart devices. They ensure thermal management, signal integrity, and digital transformation through technologies like Liquid Encapsulation, Wafer Bonding, and Photopolymer Films. Chip production relies on these materials for Die Attach, Underfill, and Dielectric applications, enhancing performance and reliability.

Market Research Overview

In the dynamic and expansive semiconductor industry, the market for advanced packaging materials, specifically encapsulation resins and wafer-level packaging, plays a pivotal role. This sector falls under the broader semiconductor materials and equipment market, which encompasses manufacturers involved in semiconductor material production, equipment manufacturing and fabrication, wafer processing, and back-end operations such as testing, assembly, and packaging. According to Technavio's market analysis, the global semiconductor materials and equipment market size is determined by the revenue generated from sales of wafer processing, mask/reticle manufacturing, wafer manufacturing, fab facilities equipment, assembly and packaging, and test equipment. The market's growth is driven by significant investments in fabrication, with the establishment of new semiconductor manufacturing plants increasing in response to the burgeoning demand for integrated circuits worldwide.. Industries are leveraging the products belonging to the market for customer engagement, transactional notifications, and promotional offers.

Technavio Research
Jesse Maida
Media & Marketing Executive
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UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/