Global Semiconductor Packaging Materials Market Analysis: USD 10158.72 Mn revenue forecasted through 2023-2027
According to Technavio's forecast, the Global Semiconductor Packaging Materials Market is estimated to exhibit growth at a CAGR of 6.06% between 2022 and 2027 followed by USD 10,158.72 Mn revenue growth.
Increasing miniaturization of electronic devices and the growing application of semiconductor ICs in IoT, advanced semiconductor material packaging technologies, and the rise in global demand for consumer electronics and smart electronic devices are some of the major determinants of market advancement.
Technavio has been monitoring the growth trajectory of the market through a detailed analysis of the prevalent market forces, trends, and drivers along with competitive benchmarking.
Global Semiconductor Packaging Materials Market Analysis
Naving through the eccentric business drivers of the market it is observed that Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT to propel the market advancement during the forecast period.
As per the data, the global consumer electronics market is expected to grow at a CAGR of more than 12% during the forecast period owing to factors like the rise in the sales of smart devices such as smartwatches, smartphones, and smart bands globally are fuelling the demand for ICs integrated together for manufacturing these devices, thus followed by the rise in the demand for semiconductor packaging equipment electronics and smart electronic devices,
When it comes to the Global Semiconductor Packaging Materials Market Amkor Technology Inc., ASE Technology Holding Co. Ltd., BASF SE, ChipMOS TECHNOLOGIES INC., DuPont de Nemours Inc., Henkel AG and Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corp., Intel Corp., KYOCERA Corp., LG Innotek Co. Ltd., MITSUI and CO. LTD., Nan Ya Printed Circuit Board Corp., Nippon Steel Corp., Powertech Technology Inc., Samsung Electronics Co. Ltd., TAIWAN SEMICONDUCTOR CO. LTD, and Texas Instruments Inc. are some of the major market participants.
For example, Amkor Technology Inc. offers semiconductor packaging materials such as copper leadframe substrates. Our report comes with a profiled analysis of the market players.
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