Die Bonder Equipment Market Size to Grow by $ 78.36 mn through 2021-2025
Technavio research projects the die bonder equipment market to grow by $ 78.36 mn, accelerating at a CAGR of almost 2% till 2025. The growth trajectory of the market is traced through a detailed analysis of the prevalent market forces, trends, and drivers along with competitive benchmarking
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Die Bonder Equipment Market: Key Market Driver
One of the primary factors that will trigger the growth of the die bonder equipment market size is increasing demand for semiconductor ICs. This research report provides a comprehensive analysis of all the factors that are likely to propel market growth, taking into account the market trends as well as challenges that are likely to impede growth. The objective of this research report is to equip clients with actionable insights that will help them leverage opportunities and formulate growth strategies for their business.
Die Bonder Equipment Market: Vendor Analysis
The market is concentrated due to the presence of several players. The growth of the players depends on several factors such as market conditions, government support, and industry development. To survive and succeed in such an intensely competitive market, players must distinguish their product and service offerings through clear and unique value propositions. ASM Pacific Technology Ltd., BE Semiconductor Industries NV, DIAS Automation (HK) Ltd., Dr. Tresky AG, Finetech GmbH & Co. KG, Kulicke and Soffa Industries Inc., Mycronic AB, Palomar Technologies Inc., SHINKAWA Ltd., and West·Bond Inc. are some of the major market participants. To make the most of the opportunities, market vendors should focus more on the growth prospects in the fast-growing segments, while maintaining their position in the slow-growing segments.
Technavio also offers custom research reports with detailed insights assessing the market from a global as well as regional perspective. This customized report will help clients keep up with new product launches in direct & indirect or related markets. It will also provide insights on upcoming developments along with a pipeline analysis of vendor operations and the impact of government regulations.
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Technavio has been monitoring the Global Die Bonder Equipment Market and is expected to grow by $ 78.36 millon, progressing at a CAGR of almost 2% during the forecast period. The growth trajectory of the market is traced through a detailed analysis of the prevalent market forces, trends, and drivers along with competitive benchmarking.
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APAC to lead market growth during the forecast period
77% of the market growth will originate from APAC during the forecast period. China and Japan are the key markets for die bonder equipment in APAC. Market growth in this region will be faster than the growth of the market in other regions. The growing production of smartphones, tablets, and other consumer electronics will facilitate the die bonder equipment market growth in APAC over the forecast period.
The increasing demand for semiconductor ICs is one of the primary factors driving the semiconductor ICS market growth. The rise in sales of both mobile and consumer electronic devices fuels the growth of the semiconductor market. Emerging technologies such as Internet of Things (IoT), M2M, UHD TVs, hybrid laptops, and vehicle automation further propel the demand for semiconductor ICs. This, in turn, will increase the requirement for packaging and assembly equipment for semiconductor ICs, thus fueling growth of the market in focus. The report offers an up-to-date analysis regarding the current global market scenario, the latest trends and drivers, and the overall market environment.
Die Bonder Equipment Market: Vendor Analysis
The market is concentrated. The growth of the players depends on several factors such as market conditions, government support, and industry development. To survive and succeed in such an intensely competitive market, players must distinguish their product and service offerings through clear and unique value propositions. ASM Pacific Technology Ltd., BE Semiconductor Industries NV, DIAS Automation (HK) Ltd., Dr. Tresky AG, Finetech GmbH & Co. KG, Kulicke and Soffa Industries Inc., Mycronic AB, Palomar Technologies Inc., SHINKAWA Ltd., and West·Bond Inc.are some of the major market participants. To make the most of the opportunities, market vendors should focus more on the growth prospects in the fast-growing segments, while maintaining their position in the slow-growing segments.
For more insights on this market: Download a Free Sample Report
Die Bonder Equipment Market: Key Highlights of the Report for 2021-2025
