The global chip mounter market is on track to expand by USD 1.45 billion between 2023 and 2028, growing at a CAGR of 5.11%. This growth is propelled by the increasing adoption of Industry 4.0 architecture, which demands advanced automation, precision placement, and integration across manufacturing systems. For leaders in electronics manufacturing, the chip mounter industry offers new avenues to optimize performance, reduce errors, and capitalize on digital transformation.
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The Chip Mounter Market is experiencing significant growth driven by advancements in surface mount technology and the increasing adoption of pick and place systems in PCB assembly. With rising demand for SMT equipment, manufacturers are focusing on improving automated placement and high-speed placement processes to enhance production efficiency and meet the needs of consumer electronics, automotive PCBs, and telecom devices. The integration of fine pitch capabilities and precision mounting is essential for assembling miniaturized devices and compact PCBs, especially in the era of Industry 4.0 and smart manufacturing. Furthermore, growing use of flexible mounters, multi-function mounters, and inline production systems is enabling better handling of complex circuit boards. As demand surges for advanced ICs, particularly in 5G chipsets and smart wearables, the market is also seeing strong alignment with IoT integration and electronic components innovation.
Leading companies are implementing strategic alliances, partnerships, mergers and acquisitions, and new product launches to strengthen their position. Key players include:
ASM Pacific Technology
DDM Novastar
Essemtec AG
Evest Corporation
Europlacer
Fuji Corporation
Hanwha Precision Machinery
Hitachi High-Tech
Juki Corporation
Kulicke & Soffa
Mirae Corporation
Mycronic
Neoden Technology
Nordson Corporation
Panasonic
SIPLACE
SMTmax
Universal Instruments
Versatec
Yamaha Motor
These companies are developing cost-effective, high-speed, and flexible chip mounters, integrating AI and ML to address evolving assembly line needs.
The market is segmented geographically and is witnessing growth across several regions:
North America:
United States
Canada
Mexico
Europe:
France
Germany
Italy
UK
APAC:
China
India
Japan
Middle East and Africa
South America
Rest of World (ROW)
APAC is projected to contribute 47% of global market growth between 2024 and 2028. Countries like China, India, Japan, Taiwan, and South Korea are fueling demand due to robust industrialization and high output in consumer electronics, automotive, and industrial machinery. The presence of cost-competitive manufacturing and rapidly expanding end-user industries has cemented APAC’s dominance in chip mounter adoption.
The chip mounter market is categorized across four core dimensions:
Surface Mount Technology (SMT)
Through-Hole Technology (THT)
Communications
Computers
Consumer Electronics
Automotive
Other Applications
High-Speed Chip Mounters
Medium-Speed Chip Mounters
Low-Speed Chip Mounters
SMT Assembly
PCB Manufacturing
The primary growth driver is the adoption of Industry 4.0, which integrates cyber-physical systems, AI, IoT, and automation in manufacturing. Electronic equipment manufacturers are investing in:
Automation and Smart Manufacturing
Data-Driven Process Optimization
High-Speed Placement Systems
Human-Robot Collaboration
This evolution has revolutionized design, fabrication, and assembly processes. By embedding machine learning into production, manufacturers are achieving enhanced production agility, error reduction, and yield improvement.
Flexibility and upgradability are defining trends. May 2022 marked a pivotal moment when Yamaha Motor Co. Ltd. introduced its One-Stop Smart Solution at SMT Connect 2022, aimed at high-speed, high-quality intelligent manufacturing. These solutions are tailored for scalable integration, enabling manufacturers to adapt swiftly to changing production requirements.
Vendors are prioritizing:
Upgrade compatibility with existing equipment
Real-time monitoring tools
Modular chip mounter architecture
Collaborative Robots (Cobots) for smart assembly
Despite its benefits, the market faces a significant barrier: high initial investment. Costs for advanced systems vary:
Benchtop Pick-and-Place Systems: ~USD 35,000
Standalone/Modular Systems: ~USD 100,000+
Additional customization based on industry needs increases the overall expenditure. As automation becomes more advanced, balancing cost and ROI remains a pressing concern for both SMEs and large manufacturers.
Surface Mount Technology (SMT) is projected to see significant growth through 2028. SMT enables the mounting of smaller, more complex components directly onto both sides of PCBs without the need for drilling, optimizing space and throughput.
Key SMT capabilities include:
Pick and Place Automation
Precision & High-Speed Placement
Collaborative Robotics for Assembly
Automated Guided Vehicles (AGVs)
Optical Inspection Systems (AOI)
Machine Learning for Production Line Integration
This technology is widely used in sectors like:
Consumer Electronics
Automotive Electronics
Medical Devices
Aerospace & Defense
Common component types include Fine Pitch Components, Flip Chips, and Ball Grid Arrays, all requiring advanced placement and inspection capabilities.
The chip mounter industry encompasses a broad range of hardware, software, and service offerings:
High-Speed Chip Mounters
Flexible Chip Mounters & Automation Systems
Vision System Calibration
Component Library & Production Data Management
Offline Programming & Simulation Tools
Preventive Maintenance & Process Control
Training, Certification, and Regulatory Compliance
Chip Mounter Design, Standards, and Installation
These services ensure continuous quality control and production efficiency, especially in high-volume environments.
For electronics manufacturers and suppliers, the chip mounter market represents a prime opportunity for:
Technology partnerships with APAC manufacturers
Smart Factory integration consulting
Flexible system imports & distributorships
OEM collaboration on high-speed automation solutions
Amid rising global competition and the push for digital transformation, investing in advanced chip mounting solutions offers a strategic path to enhanced production efficiency, reduced downtime, and greater agility.
As AI, machine learning, and robotics continue to shape the landscape, companies positioned to offer cost-effective, customizable, and smart manufacturing solutions will be best equipped to capture market share through 2028.
In-depth research on the chip mounter market reveals that emerging trends like machine vision, robotics automation, and placement accuracy are critical to maintaining quality and reliability in semiconductor assembly. With the complexity of high-density PCBs and submicron features increasing, there is a stronger emphasis on improving soldering technology, mounting speed, and PCB throughput to enhance productivity across assembly lines. Additionally, innovations in precision sensors and electronic circuits are reinforcing the shift towards manufacturing automation in the production of electronic hardware. The rise of smart wearables, expansion in telecom infrastructure, and the need for high-performance wearable tech have also underscored the importance of agile chip mounter solutions. These developments are not only optimizing operations but also redefining standards for web-based training, professional training, and virtual labs, supporting the next generation of high-tech assembly capabilities.
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