The global chip mounter market is undergoing a significant transformation, poised to expand by USD 1.45 billion from 2023 to 2028. This growth, representing a compound annual growth rate (CAGR) of 5.11%, is being driven by several converging factors. Chief among them is the escalating adoption of Industry 4.0 practices, increasing demand for highly miniaturized electronic devices, and continuous technological advancements in surface-mount technology (SMT). These trends are reshaping the landscape of printed circuit board (PCB) assembly across a broad spectrum of industries including consumer electronics, automotive, aerospace, telecommunications, and medical devices.
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The chip mounter market is segmented by Technology, Application, and Geography.
Surface Mount Technology (SMT) – Dominates the market with its high throughput, miniaturization support, and reduced production costs. SMT solutions include pick-and-place machines, chip feeders, and position recognition systems.
Through Hole Technology (THT) – Preferred for larger components and manual assembly, though less efficient for compact electronics.
The SMT segment has seen strong growth, valued at USD 4.15 billion in 2018, and continues to grow steadily due to its ability to place a large volume of components efficiently on both sides of a PCB.
Communications
Computers
Consumer Electronics
Automotive
Other Applications
Consumer electronics and telecommunications continue to lead application demand, particularly for wearables, LED screens, mobile devices, and IoT-enabled products.
Countries: China, India, Japan, Taiwan, South Korea
APAC accounted for 47% of market growth in 2023. Strong demand from PCB assembly, consumer electronics, and automobile manufacturing propels the region forward.
The region benefits from competitive manufacturing costs, industrial expansion, and high economic output.
Countries: France, Germany, Italy, UK
Europe remains a vital hub, especially for automotive, aerospace, and defense sectors relying on SMT innovations.
Countries: US, Canada, Mexico
The US leads North American adoption, with continued investments in telecommunications infrastructure and smart manufacturing technologies.
Emerging markets in these regions are gradually adopting SMT and automated mounting technologies, with potential seen in medical electronics and industrial IoT applications.
SMT continues to be the backbone of modern PCB production. Key components include:
Pick-and-place machines: Enable high-speed, accurate component placement, essential for miniaturized and complex designs.
Chip feeders: Efficiently deliver a wide variety of SMD components to the placement head.
Real-time inspection systems: Use machine vision to ensure proper alignment and soldering during production.
Solder paste alignment tools: Improve solder joint quality and reduce rework or defects.
Board support fixtures: Increase stability during high-speed mounting, reducing vibration and ensuring placement accuracy.
Industry 4.0 Integration: Smart factories rely on SMT lines, chip shooters, and automated mounting for high-speed, accurate PCB assembly.
Miniaturization and IoT: Devices are becoming smaller and more connected. Chip mounters play a crucial role in enabling energy-efficient processors, biometric sensors, wireless modules, and GPS components.
Wearables and Smart Devices: The surge in fitness trackers, augmented reality glasses, and smart clothing drives mounting technology upgrades.
E-commerce Accessibility: Online platforms have democratized access to SMT/THT equipment and related tech.
Flexible Chip Mounters: Manufacturers are embracing multi-functional, cost-effective systems with upgradable modular designs.
Advanced Feature Integration: Demand is rising for chip mounters supporting real-time inspection, automated rework, and high-speed mounters for large-scale production.
Smart Manufacturing Focus: At SMT Connect 2022, Yamaha Motor Co. Ltd. unveiled its One-Stop Smart Solution, exemplifying the trend towards intelligent, high-speed PCB production systems.
High Capital Investment:
Despite long-term cost benefits, initial investment in advanced SMT and THT systems remains a barrier for startups and low-volume manufacturers.
Technical Complexity:
Systems must handle submicron placement, fine-pitch components, and mixed-technology boards with high precision.
Skills shortage and training requirements further raise the entry barrier.
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The chip mounter market is evolving rapidly with growing demand for surface mount technology in PCB assembly applications across sectors. Key drivers include the rise in miniaturized devices and high-density PCBs, requiring fine pitch and precision mounting capabilities. Modern SMT equipment enables automated placement of electronic components on circuit boards, improving production efficiency in inline production environments. Pick place systems are integral to these assembly lines, ensuring mounting speed and placement accuracy across electronic circuits. Industries leveraging smart manufacturing and industry 4.0 practices, such as consumer electronics and automotive PCBs, are integrating flexible mounters and multi-function mounters to boost PCB throughput. Applications in wearable tech, smart wearables, and compact PCBs are driving innovation in electronic hardware design.
The competitive landscape is defined by a mix of established leaders and innovation-focused entrants. The following companies are spearheading industry advancement:
ASMPT Ltd.
Autotronik SMT GmbH
Canon Inc.
DDM Novastar Inc.
Essemtec AG
Europlacer Ltd.
FAROAD
FUJI Corp.
Hanwha Corp.
Juki Corp.
Kulicke and Soffa Industries Inc.
Manncorp Inc.
Nitto Denko Corp.
Nordson Corp.
OHASHI ENGINEERING
Panasonic Holdings Corp.
Shenzhen Langke Automation Equipment Co. Ltd.
Zhejiang Huaqi Zhengbang Automation Technology Co.
Yamaha Motor Co. Ltd.
Zhejiang NeoDen Technology Co. Ltd.
These companies are leveraging strategic alliances, mergers, acquisitions, and geographic expansion to strengthen their global footprint.
Emerging trends in the chip mounter market highlight the adoption of advanced ICs, 5G chipsets, and precision sensors to meet the demands of high-speed, high-accuracy component placement. Technologies such as machine vision and robotics automation enhance the performance of semiconductor assembly, enabling better control over submicron features and soldering technology in telecom devices and telecom infrastructure. As IoT integration expands, smart manufacturing workflows are optimizing manufacturing automation through intelligent electric circuits monitoring and predictive maintenance. This evolution supports a variety of use cases, including electronic circuits in telecom infrastructure and robust voltage regulation in industrial systems. The continued focus on battery charging capabilities and sustainable power output ensures that chip mounters remain essential to the broader push for electronics innovation and seamless crankshaft drive support in connected environments.
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